Tanja Braun studied mechanical engineering at the Technical University of Berlin with a focus on polymers and microsystems and joined Fraunhofer IZM in 1999. Since 2000, she’s working with the group Assembly & Encapsulation Technologies and since 2016, she’s the head of this group. Her field of research is process development of assembly and encapsulation processes, the qualification of these processes using both nondestructive and destructive tools and advanced polymer analysis. Her recent research is focused on wafer- and panel-level packaging technologies and she’s leading the Fan-out Panel Level Packaging Consortium at Fraunhofer IZM Berlin. In 2013, she received her doctor’s degree from the Technical University of Berlin for the work focusing on humidity diffusion through particle-filled epoxy resins.