Francesca Chiappini

Manager of the RF Chip Packaging program at CITC

Francesca Chiappini

Manager of the RF Chip Packaging program at CITC
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Biography

Francesca Chiappini has a background in solid-state physics and obtained her PhD degree from Radboud University in Nijmegen. Since 2016, she has been working at TNO as a researcher in different departments, including Holst Centre in Eindhoven, where she focused on interconnect technologies for flexible and printed electronics. In 2019, she joined the Chip Integration Technology Centre (CITC) as the project manager for the RF Chip Packaging program.

All session by Francesca Chiappini