System-in-package considerations for RF applications
Packaging is as much an upfront decision as anything else. It can certainly impact overall cost and performance especially in RF applications. In today’s applications like mobile phones, wearables or IoT the density of electronic parts is continuously increasing due to the increased appetite for new functionality. To solve the higher integration challenge the packaging technology of total systems in the package is a key driving factor on size but also on time to market. Aspects from PCB density, higher integration, performance, thermal and stress considerations and for sure impact on cost and time to market are key decision points which need to be evaluated carefully before starting the development.