Antenna in package for mm-wave applications: how to reduce losses?
Many applications in the communication, sensing and automotive domains are moving towards operation frequencies in the mm-wave portion of the EM spectrum. For these kinds of applications, antenna in package/launcher in package (AiP/LiP)-type of architectures are often adopted as they’re proven beneficial for both performance and costs. However, the high level of integration of such architectures poses several technical challenges in terms of reliability, EM shielding and heat dissipation, among others, and calls for co-design strategies and the development of new packaging technologies and materials. The Chip Integration Technology Center (CITC) and NXP have established a partnership in 2019 to address these challenges and to develop new packaging concepts and related technologies for high-performance mm-wave devices. The RF performance guides the choice of technology and packaging materials to minimize losses. One strategy to minimize losses is to use low-loss dielectric material in the package, and one common approach found in literature is to include air cavities in the antenna structure. Our work considers this approach and addresses the performance improvement of an antenna array when air cavities are introduced in the proximity of the radiating elements.