Advanced packaging for RF and mm-wave applications
Embedding technologies including fan-out wafer-level packaging (FOWLP) are the latest packaging trends in microelectronics. Embedding approaches have a high potential in significant package miniaturization concerning package volume but also in thickness. Main advantages of FOWLP are the substrate-less package, lower thermal resistance, a higher performance due to shorter interconnects, together with direct IC connection by thin-film metallization instead of wire bonds or flip-chip bumps and lower parasitic effects. Especially the inductance of the FOWLP is much lower compared to FC-BGA packages. In addition, the embedding or redistribution layer can also provide embedded passives (R, L, C), as well as antenna structures using a multi-layer structure. It can be used for multi-chip packages for system-in-package (SiP) and heterogeneous integration. Hence, embedding technologies are well suited for RF applications. Several application examples, such as a 94 GHz radar, a radar for autonomous driving, as well as multi-project fan-out wafer-level approach, will be presented, demonstrating the potential of advanced packaging for RF and mm-wave applications.